Electromigration-induced failure mode of low-temperature Sn–49Bi–1Ag hybrid BGA joint in flip chip package
This study aims to investigate the electromigration (EM)-induced failure mode of low-temperature Sn–49Bi–1Ag/Sn-3.0Ag-0.5Cu hybrid solder joints in flip chip packages. EM induced Bi atoms to diffuse towards the anode and segregate into a continuous and thick Bi layer, with the microstructure evolvin...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425013535 |
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