Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics
The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metall...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Uralʹskij federalʹnyj universitet imeni pervogo Prezidenta Rossii B.N. Elʹcina
2022-07-01
|
| Series: | Chimica Techno Acta |
| Subjects: | |
| Online Access: | https://chimicatechnoacta.ru/article/view/5990 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|