A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects

A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects

As electronic devices continue to shrink in size and increase in complexity, the current densities in interconnects drastically increase, intensifying the effects of electromigration (EM). This renders the understanding of EM crucial, due to its significant implications for device reliability and lo...

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Bibliographic Details
Main Authors: Ahmed Sobhi Saleh, Kristof Croes, Hajdin Ceric, Ingrid De Wolf, Houman Zahedmanesh
Format: Article
Language:English
Published: MDPI AG 2024-11-01
Series:Nanomaterials
Subjects:
interconnect
stress evolution
void nucleation
void-dynamics
copper
electromigration
Online Access:https://www.mdpi.com/2079-4991/14/22/1834
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