A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
As electronic devices continue to shrink in size and increase in complexity, the current densities in interconnects drastically increase, intensifying the effects of electromigration (EM). This renders the understanding of EM crucial, due to its significant implications for device reliability and lo...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/14/22/1834 |
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