Saleh, A. S., Croes, K., Ceric, H., Wolf, I. D., & Zahedmanesh, H. A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects. MDPI AG.
Chicago Style (17th ed.) CitationSaleh, Ahmed Sobhi, Kristof Croes, Hajdin Ceric, Ingrid De Wolf, and Houman Zahedmanesh. A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects. MDPI AG.
MLA (9th ed.) CitationSaleh, Ahmed Sobhi, et al. A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects. MDPI AG.
Warning: These citations may not always be 100% accurate.