Rapid analysis of temperature fields in electronic enclosures based on the finite difference thermal resistance network method
With the accelerated pace of functional updates and iteration in electronic enclosures design, the thermal design cycle is continuously shortened. However, the computational process of numerical simulation methods based on the finite element method (FEM) and finite volume method (FVM) is time-consum...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24016824 |
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