A Review of Non-Uniform Load Distribution and Solutions in Data Centers: Micro-Scale Liquid Cooling and Large-Scale Air Cooling
Nowadays, the number of transistors on electronic components is increasing exponentially leading to an ultra-high heat flux (10<sup>6</sup>~10<sup>7</sup> W/m<sup>2</sup>). The non-uniform load distribution on the chip and the local hot spots in the thermal enviro...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/18/1/149 |
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