EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER
The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with differen...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2018-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015 |
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