Sputtering yield amplification of Si through the addition of Cu, Mo, or Ta
In the sputtering process, the cascade of collisions in the target surface plays a crucial role, as it determines the emission mechanics of the sputtered atoms. This phenomenon is typically described for targets composed of a single elemental type. However, introducing a second element with a differ...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2025-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/adfad4 |
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