Frequency-comb-referenced multiwavelength interferometry for high-precision and high-speed 3D measurement in heterogeneous semiconductor packaging
As Moore’s law approaches its physical limits, the semiconductor industry has begun to focus on improving I/O density and power efficiency through 2.5D/3D packaging. Heterogeneous integration, which combines integrated circuit blocks from different linewidth processes into a single package, is centr...
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| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2025-02-01
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| Series: | Nanophotonics |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/nanoph-2024-0578 |
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