RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT
Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on strain energy was suitable for multiple compon...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
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Editorial Office of Journal of Mechanical Strength
2022-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2022.03.025 |
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| _version_ | 1841536058044448768 |
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| author | CU QiangYi LIU ZhiHu TIAN Feng ZHANG FengHua ZHAO Gang WU Bo |
| author_facet | CU QiangYi LIU ZhiHu TIAN Feng ZHANG FengHua ZHAO Gang WU Bo |
| author_sort | CU QiangYi |
| collection | DOAJ |
| description | Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on strain energy was suitable for multiple components on PCBA. The accelerated test method of thermal fatigue life of solder joints was discussed, the accelerated test case proved that the test was feasible, and the simulation was credible. The results indicated that the simulation and accelerated test method of thermal fatigue life of solder joints were suitable for engineering application. |
| format | Article |
| id | doaj-art-e09ed3b8087b424faa9aabcfb1ee2a50 |
| institution | Kabale University |
| issn | 1001-9669 |
| language | zho |
| publishDate | 2022-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj-art-e09ed3b8087b424faa9aabcfb1ee2a502025-01-15T02:24:15ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692022-01-014469169529912936RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENTCU QiangYiLIU ZhiHuTIAN FengZHANG FengHuaZHAO GangWU BoAiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on strain energy was suitable for multiple components on PCBA. The accelerated test method of thermal fatigue life of solder joints was discussed, the accelerated test case proved that the test was feasible, and the simulation was credible. The results indicated that the simulation and accelerated test method of thermal fatigue life of solder joints were suitable for engineering application.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2022.03.025Airborne electronic equipmentSolder jointsThermal fatigue lifeSimulationAccelerated test |
| spellingShingle | CU QiangYi LIU ZhiHu TIAN Feng ZHANG FengHua ZHAO Gang WU Bo RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT Jixie qiangdu Airborne electronic equipment Solder joints Thermal fatigue life Simulation Accelerated test |
| title | RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT |
| title_full | RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT |
| title_fullStr | RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT |
| title_full_unstemmed | RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT |
| title_short | RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT |
| title_sort | research on thermal fatigue life of solder joints for airborne electronic equipment |
| topic | Airborne electronic equipment Solder joints Thermal fatigue life Simulation Accelerated test |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2022.03.025 |
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