Study of the stress relaxation resistance and microstructural evolution of a Cu–Ni–Si alloy strip

The stress relaxation resistance of a Cu–Ni–Si alloy strip after 48 h of initial loading stress of 80% σ0.2 at 125 °C was studied. The stress relaxation curve was fitted using a model. By employing EBSD, TEM, and other techniques, this study examined the microstructural characteristics of the Cu–Ni–...

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Bibliographic Details
Main Authors: Yanmin Zhang, Yaopeng Yang, Yaoli Wang, Zaoli Zhang, Jiang Feng, Chaomin Zhang, Kexing Song
Format: Article
Language:English
Published: Elsevier 2024-11-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424022774
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