Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle
In this paper, the typical planar packaging technologies of HEV/EV power semiconductor module were presented. Firstly, the functionality and performance requirements for power module by automotive power system, as well as the challenges and mitigation strategy of automotive power module packaging, w...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
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Editorial Office of Control and Information Technology
2017-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.05.005 |
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| _version_ | 1849224834208235520 |
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| author | WANG Yangang LIU Xuyu DAI Xiaoping WU Yibo PENG Yongdian LIU Guoyou |
| author_facet | WANG Yangang LIU Xuyu DAI Xiaoping WU Yibo PENG Yongdian LIU Guoyou |
| author_sort | WANG Yangang |
| collection | DOAJ |
| description | In this paper, the typical planar packaging technologies of HEV/EV power semiconductor module were presented. Firstly, the functionality and performance requirements for power module by automotive power system, as well as the challenges and mitigation strategy of automotive power module packaging, were discussed. The typical state-of-the-art HEV/EV modules assembled by planar technology were reviewed and analyzed in terms of the structure and packaging technologies. Finally, the outlook of next generation key packaging technologies of planar automotive module was proposed. |
| format | Article |
| id | doaj-art-d95156f5b3844d0788d907499ba7cf7e |
| institution | Kabale University |
| issn | 2096-5427 |
| language | zho |
| publishDate | 2017-01-01 |
| publisher | Editorial Office of Control and Information Technology |
| record_format | Article |
| series | Kongzhi Yu Xinxi Jishu |
| spelling | doaj-art-d95156f5b3844d0788d907499ba7cf7e2025-08-25T06:53:35ZzhoEditorial Office of Control and Information TechnologyKongzhi Yu Xinxi Jishu2096-54272017-01-0134364182323569Planar Packaging Technology of Power Semiconductor Module for Electric VehicleWANG YangangLIU XuyuDAI XiaopingWU YiboPENG YongdianLIU GuoyouIn this paper, the typical planar packaging technologies of HEV/EV power semiconductor module were presented. Firstly, the functionality and performance requirements for power module by automotive power system, as well as the challenges and mitigation strategy of automotive power module packaging, were discussed. The typical state-of-the-art HEV/EV modules assembled by planar technology were reviewed and analyzed in terms of the structure and packaging technologies. Finally, the outlook of next generation key packaging technologies of planar automotive module was proposed.http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.05.005hybrid and electric vehicleIGBT moduleplanar packaging technologypower control unitreliability |
| spellingShingle | WANG Yangang LIU Xuyu DAI Xiaoping WU Yibo PENG Yongdian LIU Guoyou Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle Kongzhi Yu Xinxi Jishu hybrid and electric vehicle IGBT module planar packaging technology power control unit reliability |
| title | Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle |
| title_full | Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle |
| title_fullStr | Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle |
| title_full_unstemmed | Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle |
| title_short | Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle |
| title_sort | planar packaging technology of power semiconductor module for electric vehicle |
| topic | hybrid and electric vehicle IGBT module planar packaging technology power control unit reliability |
| url | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.05.005 |
| work_keys_str_mv | AT wangyangang planarpackagingtechnologyofpowersemiconductormoduleforelectricvehicle AT liuxuyu planarpackagingtechnologyofpowersemiconductormoduleforelectricvehicle AT daixiaoping planarpackagingtechnologyofpowersemiconductormoduleforelectricvehicle AT wuyibo planarpackagingtechnologyofpowersemiconductormoduleforelectricvehicle AT pengyongdian planarpackagingtechnologyofpowersemiconductormoduleforelectricvehicle AT liuguoyou planarpackagingtechnologyofpowersemiconductormoduleforelectricvehicle |