Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle
In this paper, the typical planar packaging technologies of HEV/EV power semiconductor module were presented. Firstly, the functionality and performance requirements for power module by automotive power system, as well as the challenges and mitigation strategy of automotive power module packaging, w...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2017-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.05.005 |
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