Yangang, W., Xuyu, L., Xiaoping, D., Yibo, W., Yongdian, P., & Guoyou, L. Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle. Editorial Office of Control and Information Technology.
Chicago Style (17th ed.) CitationYangang, WANG, LIU Xuyu, DAI Xiaoping, WU Yibo, PENG Yongdian, and LIU Guoyou. Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle. Editorial Office of Control and Information Technology.
MLA (9th ed.) CitationYangang, WANG, et al. Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle. Editorial Office of Control and Information Technology.
Warning: These citations may not always be 100% accurate.