Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique

In this study, rupture of notched SENT specimens fabricated from a novel lead-free solder alloy is investigated. The lead-free solder alloy, focused on in this study, is particularly used as interconnect material in power modules of electric vehicles. Its commercial denomination is InnoLot and it c...

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Bibliographic Details
Main Authors: Tao Quang Bang, Nguyen Van Thien An, Lahouari Benabou, Nguyen Xuan Hung
Format: Article
Language:English
Published: Publishing House for Science and Technology 2020-03-01
Series:Vietnam Journal of Mechanics
Subjects:
Online Access:https://vjs.ac.vn/index.php/vjmech/article/view/14397
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