Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering
Cu-Al layered structures are frequently encountered in electrical and electronic devices and facilities as both metals possess a high electrical conductivity. In the present work, a new approach was used to fabricate Cu-Al bi-layers. The layers were formed by successively depositing copper and alumi...
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| Format: | Article |
| Language: | English |
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International Institute for the Science of Sintering, Beograd
2024-01-01
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| Series: | Science of Sintering |
| Subjects: | |
| Online Access: | https://doiserbia.nb.rs/img/doi/0350-820X/2024/0350-820X2300062D.pdf |
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| author | Dudina Dina V. Ulianitsky Vladimir Yu. Tokarev Vadim G. |
| author_facet | Dudina Dina V. Ulianitsky Vladimir Yu. Tokarev Vadim G. |
| author_sort | Dudina Dina V. |
| collection | DOAJ |
| description | Cu-Al layered structures are frequently encountered in electrical and electronic devices and facilities as both metals possess a high electrical conductivity. In the present work, a new approach was used to fabricate Cu-Al bi-layers. The layers were formed by successively depositing copper and aluminum on a steel substrate by detonation spraying. The layered structures were annealed in a vacuum furnace or treated by electric current in a spark plasma sintering (SPS) facility. Both furnace annealing and SPS induced the formation of Cu-Al intermetallics, the thickness of the product layers being greater after the SPS treatment. The effect of applied pressure alone could not fully account for the difference between the outcomes of furnace annealing and SPS. The main products formed during both annealing and SPS were CuAl2 and Cu9Al4. The application of pressure during SPS allowed eliminating the interfacial porosity. Conventional annealing was not instrumental for this purpose. |
| format | Article |
| id | doaj-art-d08121aae6e247fd90f50acadb82b39e |
| institution | Kabale University |
| issn | 0350-820X 1820-7413 |
| language | English |
| publishDate | 2024-01-01 |
| publisher | International Institute for the Science of Sintering, Beograd |
| record_format | Article |
| series | Science of Sintering |
| spelling | doaj-art-d08121aae6e247fd90f50acadb82b39e2024-11-15T10:51:36ZengInternational Institute for the Science of Sintering, BeogradScience of Sintering0350-820X1820-74132024-01-0156332733410.2298/SOS231026062D0350-820X2300062DFormation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sinteringDudina Dina V.0https://orcid.org/0000-0003-0010-4638Ulianitsky Vladimir Yu.1https://orcid.org/0000-0002-3538-1486Tokarev Vadim G.2https://orcid.org/0000-0002-3085-1477Lavrentyev Institute of Hydrodynamics SB RAS, Novosibirsk, Russia + Institute of Solid State Chemistry and Mechanochemistry SB RAS, Novosibirsk, RussiaLavrentyev Institute of Hydrodynamics SB RAS, Novosibirsk, RussiaNovosibirsk State Technical University, Novosibirsk, RussiaCu-Al layered structures are frequently encountered in electrical and electronic devices and facilities as both metals possess a high electrical conductivity. In the present work, a new approach was used to fabricate Cu-Al bi-layers. The layers were formed by successively depositing copper and aluminum on a steel substrate by detonation spraying. The layered structures were annealed in a vacuum furnace or treated by electric current in a spark plasma sintering (SPS) facility. Both furnace annealing and SPS induced the formation of Cu-Al intermetallics, the thickness of the product layers being greater after the SPS treatment. The effect of applied pressure alone could not fully account for the difference between the outcomes of furnace annealing and SPS. The main products formed during both annealing and SPS were CuAl2 and Cu9Al4. The application of pressure during SPS allowed eliminating the interfacial porosity. Conventional annealing was not instrumental for this purpose.https://doiserbia.nb.rs/img/doi/0350-820X/2024/0350-820X2300062D.pdfcu-al layered materialinterfaceintermetallicdetonation sprayingspark plasma sintering |
| spellingShingle | Dudina Dina V. Ulianitsky Vladimir Yu. Tokarev Vadim G. Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering Science of Sintering cu-al layered material interface intermetallic detonation spraying spark plasma sintering |
| title | Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering |
| title_full | Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering |
| title_fullStr | Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering |
| title_full_unstemmed | Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering |
| title_short | Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering |
| title_sort | formation of cu al layered materials by detonation spraying and modification of the interface by annealing spark plasma sintering |
| topic | cu-al layered material interface intermetallic detonation spraying spark plasma sintering |
| url | https://doiserbia.nb.rs/img/doi/0350-820X/2024/0350-820X2300062D.pdf |
| work_keys_str_mv | AT dudinadinav formationofcuallayeredmaterialsbydetonationsprayingandmodificationoftheinterfacebyannealingsparkplasmasintering AT ulianitskyvladimiryu formationofcuallayeredmaterialsbydetonationsprayingandmodificationoftheinterfacebyannealingsparkplasmasintering AT tokarevvadimg formationofcuallayeredmaterialsbydetonationsprayingandmodificationoftheinterfacebyannealingsparkplasmasintering |