Formation of Cu-Al layered materials by detonation spraying and modification of the interface by annealing/spark plasma sintering
Cu-Al layered structures are frequently encountered in electrical and electronic devices and facilities as both metals possess a high electrical conductivity. In the present work, a new approach was used to fabricate Cu-Al bi-layers. The layers were formed by successively depositing copper and alumi...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
International Institute for the Science of Sintering, Beograd
2024-01-01
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| Series: | Science of Sintering |
| Subjects: | |
| Online Access: | https://doiserbia.nb.rs/img/doi/0350-820X/2024/0350-820X2300062D.pdf |
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