Growth of Surface Oxide Layers on Dendritic Cu Particles by Wet Treatment and Enhancement of Sinter-Bondability by Using Cu Paste Containing the Particles
Pastes were prepared using dendritic Cu particles as fillers, and a compression die attachment process was implemented to establish a pure Cu joint using low-cost materials and high-speed sinter bonding. We aimed to grow an oxidation layer on the particle surface to improve sinter-bondability. Becau...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/14/11/1254 |
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