Effects of electrodeposition current density and additives on the microstructure and mechanical properties of copper films
In CoWoS (Chip on Wafer on Substrate) packages, the mechanical properties face serious problems with decreasing Cu pillar size. In this paper, twinned Cu films were prepared by DC (DirectCurrent) electrodeposition with the addition of MPS (Sodium 3-mercapto-1-propanesulfonate), gelatin and SPS (Sodi...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425007227 |
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