Study of the Package Degradation of IGBT Module during Thermal Cycling Test
Failure mechanisms of IGBT module are complex, one of which is package degradation. To eliminate the interference of application condition and other effects, the correlation between module failure and package degradation was built via severe thermal cycling test. Results show that the degradation wi...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2016-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.04.005 |
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