APA (7th ed.) Citation

Dong, W., Liu, D., & Xu, F. Performance characterization of Au–Ge solder ball bumps fabricated via the Pulsated Orifice Ejection Method. Elsevier.

Chicago Style (17th ed.) Citation

Dong, Wei, Donghang Liu, and Fumin Xu. Performance Characterization of Au–Ge Solder Ball Bumps Fabricated via the Pulsated Orifice Ejection Method. Elsevier.

MLA (9th ed.) Citation

Dong, Wei, et al. Performance Characterization of Au–Ge Solder Ball Bumps Fabricated via the Pulsated Orifice Ejection Method. Elsevier.

Warning: These citations may not always be 100% accurate.