Performance characterization of Au–Ge solder ball bumps fabricated via the Pulsated Orifice Ejection Method

The Gold-28at% Germanium (Au-28at%Ge) eutectic alloy exhibits significant potential as a replacement for high-lead solder alloys due to its excellent mechanical properties and corrosion resistance. However, its widespread application is limited by inherent brittleness. In this study, Au–Ge eutectic...

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Bibliographic Details
Main Authors: Wei Dong, Donghang Liu, Fumin Xu
Format: Article
Language:English
Published: Elsevier 2025-09-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425019957
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