Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices
In the application of power converters, the ambient temperature (<i>T<sub>a</sub></i>) experiences significant fluctuations. For the case-to-ambient resistance (<i>R<sub>ca</sub></i>), apart from the influence of the material’s inherent properties, fac...
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| Main Authors: | Kaixin Wei, Peiji Shi, Pili Bao, Chuanchao Liu, Yanzhou Qin |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
|
| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/17/22/5692 |
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