Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits

Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits

This paper proposed the carbon materials (including MLGNR, MWCNT and SWCNT) to replace the traditional Cu as the filler of through silicon via (TSV) for enhancing heat transfer performance of three-dimensional integrated circuits (3-D ICs), meanwhile the corresponding mathematical model is establish...

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Bibliographic Details
Main Authors: Peng Xu, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, Hui Liu
Format: Article
Language:English
Published: Elsevier 2025-02-01
Series:Case Studies in Thermal Engineering
Subjects:
3-D ICs
TSVs array
Carbon materials
Heat transfer performance
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X24017568
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