Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
This paper examines multiscale theories and numerical methods for interconnect materials in electronic packaging, focusing on the interplay among micro-scale morphology, meso-scale structure, and macro-scale behavior to improve material reliability and performance prediction. It reviews advanced mat...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Frontiers Media S.A.
2024-12-01
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| Series: | Frontiers in Materials |
| Subjects: | |
| Online Access: | https://www.frontiersin.org/articles/10.3389/fmats.2024.1532859/full |
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