A Nonintrusive Nonlinear Model Reduction Method for Thermal Cycling-Induced Viscoplastic Deformation Problems Based on Segmented Gaussian Process Regression Machine Learning
Numerical simulation of thermal cycling-induced viscoplastic deformation is important to design a reliable underfilled flip chip package, where the time histories of viscoplastic strains are applied to predict the fatigue life of solder joints. However, the high-fidelity full model simulations of a...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10824784/ |
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