Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation
The purpose of this study was to investigate optimum test conditions of acoustical-mechanical measurement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Forcedisplacement and acoustic signals were simultaneously recorded applying two different methods (3-point bend...
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| Format: | Article |
| Language: | English |
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ISEKI_Food Association (IFA)
2018-04-01
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| Series: | International Journal of Food Studies |
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| Online Access: | https://www.iseki-food-ejournal.com/article/74 |
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| _version_ | 1846129703137574912 |
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| author | Erdem Carsanba Gerhard Schleining |
| author_facet | Erdem Carsanba Gerhard Schleining |
| author_sort | Erdem Carsanba |
| collection | DOAJ |
| description | The purpose of this study was to investigate optimum test conditions of acoustical-mechanical measurement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Forcedisplacement and acoustic signals were simultaneously recorded applying two different methods (3-point bending and cutting test). In order to study acoustical-mechanical behaviour of wafers, the parameters “maximum sound pressure”, “total count peaks” and “mean sound value” were used and optimal test conditions of microphone position and test speed were examined. With a microphone position of 45° angle and 1 cm distance and at a low test speed of 0.5 mm/s wafers of different quality could be distinguished best. The angle of microphone did not have significant effect on acoustic results and the nu |
| format | Article |
| id | doaj-art-a84442efd8f74bffb48c583d0c05f728 |
| institution | Kabale University |
| issn | 2182-1054 |
| language | English |
| publishDate | 2018-04-01 |
| publisher | ISEKI_Food Association (IFA) |
| record_format | Article |
| series | International Journal of Food Studies |
| spelling | doaj-art-a84442efd8f74bffb48c583d0c05f7282024-12-09T23:16:24ZengISEKI_Food Association (IFA)International Journal of Food Studies2182-10542018-04-017110.7455/ijfs/7.1.2018.a2Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformationErdem Carsanba0Gerhard Schleining1Mustafa Kemal University, Antakya, TurkeyDepartment of Food Science and Technology, BOKU-University of Natural Resources and Life Sciences, AustriaThe purpose of this study was to investigate optimum test conditions of acoustical-mechanical measurement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Forcedisplacement and acoustic signals were simultaneously recorded applying two different methods (3-point bending and cutting test). In order to study acoustical-mechanical behaviour of wafers, the parameters “maximum sound pressure”, “total count peaks” and “mean sound value” were used and optimal test conditions of microphone position and test speed were examined. With a microphone position of 45° angle and 1 cm distance and at a low test speed of 0.5 mm/s wafers of different quality could be distinguished best. The angle of microphone did not have significant effect on acoustic results and the nuhttps://www.iseki-food-ejournal.com/article/74AcousticCrispnessTextureWafer |
| spellingShingle | Erdem Carsanba Gerhard Schleining Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation International Journal of Food Studies Acoustic Crispness Texture Wafer |
| title | Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation |
| title_full | Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation |
| title_fullStr | Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation |
| title_full_unstemmed | Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation |
| title_short | Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation |
| title_sort | examination of optimum test conditions for a 3 point bending and cutting test to evaluate sound emission of wafer during deformation |
| topic | Acoustic Crispness Texture Wafer |
| url | https://www.iseki-food-ejournal.com/article/74 |
| work_keys_str_mv | AT erdemcarsanba examinationofoptimumtestconditionsfora3pointbendingandcuttingtesttoevaluatesoundemissionofwaferduringdeformation AT gerhardschleining examinationofoptimumtestconditionsfora3pointbendingandcuttingtesttoevaluatesoundemissionofwaferduringdeformation |