Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation
The purpose of this study was to investigate optimum test conditions of acoustical-mechanical measurement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Forcedisplacement and acoustic signals were simultaneously recorded applying two different methods (3-point bend...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
ISEKI_Food Association (IFA)
2018-04-01
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| Series: | International Journal of Food Studies |
| Subjects: | |
| Online Access: | https://www.iseki-food-ejournal.com/article/74 |
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