Carsanba, E., & Schleining, G. Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation. ISEKI_Food Association (IFA).
Chicago Style (17th ed.) CitationCarsanba, Erdem, and Gerhard Schleining. Examination of Optimum Test Conditions for a 3-point Bending and Cutting Test to Evaluate Sound Emission of Wafer During Deformation. ISEKI_Food Association (IFA).
MLA (9th ed.) CitationCarsanba, Erdem, and Gerhard Schleining. Examination of Optimum Test Conditions for a 3-point Bending and Cutting Test to Evaluate Sound Emission of Wafer During Deformation. ISEKI_Food Association (IFA).
Warning: These citations may not always be 100% accurate.