Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module

Research on Pressure-contact Technology of Power Terminals for the Design of High-integration IGBT Module

It briefly introduced the package principle of pressure-contact IGBT devices. In order to achieve high-integration of IGBT module, the effect of pressure-contact technology on its impendence characteristic, parallel application and thermal performance was studied. A design scheme of press-contact IG...

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Bibliographic Details
Main Authors: YUAN Yong, XIONG Hui, HUANG Nan, CHEN Yanping, XIN Li
Format: Article
Language:zho
Published: Editorial Office of Control and Information Technology 2017-01-01
Series:Kongzhi Yu Xinxi Jishu
Subjects:
IGBT module
pressure-contact
impendence distribution
parameter consistency
thermal performance
Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.01.008
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