Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate
Abstract Thin copper substrates with high accuracy are highly required in precision physical experiments. However, even using double-sided lapping, the flatness is still limited due to the accuracy of lapping plate, process vibration and so on. Hence, as a subsequent process, this paper employs magn...
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| Format: | Article |
| Language: | English |
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SpringerOpen
2024-12-01
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| Series: | Chinese Journal of Mechanical Engineering |
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| Online Access: | https://doi.org/10.1186/s10033-024-01154-x |
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| _version_ | 1846101424605233152 |
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| author | Bo Pan Renke Kang Yunfei Zhang Kailong Li Dongxing Du Xiaoguang Guo Chao Wang Jiang Guo Xianglong Zhu Wen Huang |
| author_facet | Bo Pan Renke Kang Yunfei Zhang Kailong Li Dongxing Du Xiaoguang Guo Chao Wang Jiang Guo Xianglong Zhu Wen Huang |
| author_sort | Bo Pan |
| collection | DOAJ |
| description | Abstract Thin copper substrates with high accuracy are highly required in precision physical experiments. However, even using double-sided lapping, the flatness is still limited due to the accuracy of lapping plate, process vibration and so on. Hence, as a subsequent process, this paper employs magnetorheological finishing (MRF) to further improve the flatness. Nevertheless, thin copper substrates, which are sensitive to the stress, deformed easily with uneven material removal on the surface. Therefore, MRF is adopted on machining thin copper substrate for the first time considering deformation induced by stress. A finite element model is established to evaluate the deformation by residual stress, and the results show that the deformation tends to be more serious with the increase of the material removal. According to the simulation results, the material removal is optimized considering both deformation and efficiency, and a series of experiments are conducted on a Φ100×2.8 mm workpiece to verify the simulation results. The experimental results show that the flatness is further improved from peak to valley (PV) 6.6 μm to PV 2.3 μm with optimized processing parameters. Hence, the feasibility of magnetorheological finishing on thin copper substrate is demonstrated. |
| format | Article |
| id | doaj-art-9bef2894dfa240ae84b8d4e46aaf4220 |
| institution | Kabale University |
| issn | 2192-8258 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | SpringerOpen |
| record_format | Article |
| series | Chinese Journal of Mechanical Engineering |
| spelling | doaj-art-9bef2894dfa240ae84b8d4e46aaf42202024-12-29T12:12:31ZengSpringerOpenChinese Journal of Mechanical Engineering2192-82582024-12-0137111010.1186/s10033-024-01154-xFeasibility Study on Magnetorheological Finishing of Thin Copper SubstrateBo Pan0Renke Kang1Yunfei Zhang2Kailong Li3Dongxing Du4Xiaoguang Guo5Chao Wang6Jiang Guo7Xianglong Zhu8Wen Huang9Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of TechnologyKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of TechnologyInstitute of Mechanical Manufacturing Technology, China Academy of Engineering PhysicsInstitute of Mechanical Manufacturing Technology, China Academy of Engineering PhysicsInstitute of Mechanical Manufacturing Technology, China Academy of Engineering PhysicsKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of TechnologyInstitute of Mechanical Manufacturing Technology, China Academy of Engineering PhysicsKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of TechnologyKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of TechnologyInstitute of Mechanical Manufacturing Technology, China Academy of Engineering PhysicsAbstract Thin copper substrates with high accuracy are highly required in precision physical experiments. However, even using double-sided lapping, the flatness is still limited due to the accuracy of lapping plate, process vibration and so on. Hence, as a subsequent process, this paper employs magnetorheological finishing (MRF) to further improve the flatness. Nevertheless, thin copper substrates, which are sensitive to the stress, deformed easily with uneven material removal on the surface. Therefore, MRF is adopted on machining thin copper substrate for the first time considering deformation induced by stress. A finite element model is established to evaluate the deformation by residual stress, and the results show that the deformation tends to be more serious with the increase of the material removal. According to the simulation results, the material removal is optimized considering both deformation and efficiency, and a series of experiments are conducted on a Φ100×2.8 mm workpiece to verify the simulation results. The experimental results show that the flatness is further improved from peak to valley (PV) 6.6 μm to PV 2.3 μm with optimized processing parameters. Hence, the feasibility of magnetorheological finishing on thin copper substrate is demonstrated.https://doi.org/10.1186/s10033-024-01154-xMagnetorheological finishingThin copper substrateFlatnessDeformation |
| spellingShingle | Bo Pan Renke Kang Yunfei Zhang Kailong Li Dongxing Du Xiaoguang Guo Chao Wang Jiang Guo Xianglong Zhu Wen Huang Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate Chinese Journal of Mechanical Engineering Magnetorheological finishing Thin copper substrate Flatness Deformation |
| title | Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate |
| title_full | Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate |
| title_fullStr | Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate |
| title_full_unstemmed | Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate |
| title_short | Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate |
| title_sort | feasibility study on magnetorheological finishing of thin copper substrate |
| topic | Magnetorheological finishing Thin copper substrate Flatness Deformation |
| url | https://doi.org/10.1186/s10033-024-01154-x |
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