Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions
Abstract Direct wafer bonding allows polished semiconductor wafers to be joined together without the use of a binder. It has a wide range of applications in integrated circuit fabrication, micro-electro-mechanical systems (MEMS) packaging and multifunctional chip integration. Chip deflection and str...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2025-08-01
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| Series: | Microsystems & Nanoengineering |
| Online Access: | https://doi.org/10.1038/s41378-025-00994-4 |
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