Application of Silver Sintering Technology in Press-pack IGBTs
Silver sintering technology which has the characteristics of low temperature connection, low thermal resistance, low stress and high melting point, has gradually become the application trend of interface reliability-connection in insulated gate bipolar transistors(IGBT). The mechanism of silver sint...
Saved in:
| Main Authors: | Tingchang SHI, Han LI, Guiqin CHANG, Haihui LUO, Guozhong DONG, Guoyou LIU |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
|
| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.020 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Thermal Design and Simulation of High Power Press-pack IGBT Module
by: XIAO Hongxiu, et al.
Published: (2016-01-01) -
Research on the Press-pack IGBT with High SCSOA
by: LENG Guoqing, et al.
Published: (2017-01-01) -
Mechanical Stress Analysis in High Power Press Pack IGBT
by: Xinling TANG, et al.
Published: (2020-12-01) -
Study of Thermal Characteristics on Press-pack IGBT Modules
by: DOU Ze-chun, et al.
Published: (2013-01-01) -
Accelerate Aging Test Method for Press-Pack IGBT Power Module
by: Biaojun LI, et al.
Published: (2022-10-01)