Research on the Reliability of Aluminum Nitride Ceramic Substrate for IGBT
With the rapid development and widespread use of power electronic devices, especially high voltage and high current IGBT modules, higher performance is put forward for ceramic substrate in package materials, and reliability requirements are one of the most critical indicators for the design of ceram...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2017-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2017.05.009 |
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