Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent
The use of additives facilitates the deposition of copper on metal substrates.In this work，using choline chloride glacial acetic acid(Ch Cl-Gl A) as a low eutectic solvent and copper acetate as the main salt， the effects of ascorbic acid(C6H8O6)， disodium ethylenediamine tetraacetic acid(EDTA-2Na) a...
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| Main Author: | |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Materials Protection
2024-12-01
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| Series: | Cailiao Baohu |
| Subjects: | |
| Online Access: | http://www.mat-pro.com/fileup/1001-1560/PDF/20241202.pdf |
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