IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase
In the use of Sn58Bi solder alloy, the abnormal enrichment and coarsening of Bi phase in solder joints and the excessive growth of IMC seriously affect its service reliability, among which, the IMC's reaction mechanism and evolution, the influence on the coarsening of the Bi phase within the so...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424025341 |
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