An Overview of AI Hardware Architectures and Silicon for 3-D Spatial Computing Systems

An Overview of AI Hardware Architectures and Silicon for 3-D Spatial Computing Systems

As artificial intelligence (AI) advances, 3-D spatial computing has emerged as a key application in various fields. It interprets the 3-D space surrounding users and provides them with useful information. This article presents a survey of AI hardware architectures and silicon solutions for 3-D spati...

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Bibliographic Details
Main Authors: Dongseok Im, Gwangtae Park, Junha Ryu, Hoi-Jun Yoo
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Open Journal of the Solid-State Circuits Society
Subjects:
3-D data analysis
3-D data capturing
3-D hand motion analysis
3-D rendering
3-D spatial computing
artificial intelligence (AI)
Online Access:https://ieeexplore.ieee.org/document/11026096/
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https://ieeexplore.ieee.org/document/11026096/

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