Technology options for embedding low-profile electronic components in printed circuit boards
In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehperiodika
2018-02-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | https://tkea.com.ua/index.php/journal/article/view/167 |
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