Guest Editorial: Nanopackaging Part I
This is the first of two Special Sections on Nanopackaging. This first one has appeared in OJ-NANO Vol. 2, 2021 and the second will appear in Vol. 3, 2022. Electronics packaging is a very multidisciplinary activity requiring an understanding of Electrical, Mechanical, Materials, Thermal (and Thermom...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Open Journal of Nanotechnology |
| Online Access: | https://ieeexplore.ieee.org/document/9662658/ |
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