New Generation Package PrimePACKTM3+ Improving the Performance of IGBT5 Module
To fully implement the feature of higher junction temperature for IGBT5, a new generation PrimePACKTM3+ module with the latest .XT technology and innovative design method is used to increase output current capability comparing with PrimePACKTM3 with the same size and footprint. The second AC bus bar...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2016-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.01.006 |
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