Room‐Temperature Direct Homolysis of Csp3─H Bond via Catalyst‐Free Photoexcitation

ABSTRACT The C─H bond is the most abundant chemical bond in organic compounds. Therefore, the development of the more direct methods for C─H bond cleavage and the elucidation of their mechanisms will provide an important theoretical basis for achieving more efficient C─H functionalization and target...

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Bibliographic Details
Main Authors: Qi Miao, Meng Liu, Jun Wang, Pan Wu, Changjun Liu, Jian He, Giacomo Lo Zupone, Wei Jiang
Format: Article
Language:English
Published: Wiley 2025-08-01
Series:Exploration
Subjects:
Online Access:https://doi.org/10.1002/EXP.20240237
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