Thermal Management Technology of New-generation High-voltage SiC Devices Applied in Rail Transit Traction System
The wide band-gap devices represented by SiC are becoming the research focus of power semiconductor devices. The new generation of high-voltage packaging is the main packaging form for high-power SiC devices to cope with high-voltage, heat dissipation and parallel use. In this paper, the key thermal...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2020-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2020.05.013 |
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