Automated Thermal Optimization of Pinfin Heatsinks for Three-Phase Multichip SiC Power Modules
With the growing demands for compact and high-efficiency electric vehicle (EV) drive systems, effective thermal management of Silicon Carbide (SiC) power modules has become a critical design challenge. This paper proposes an optimization methodology for Pinfin heatsinks, aiming to effectively reduce...
Saved in:
| Main Authors: | Xiaoshuang Hui, Puqi Ning, Tao Fan, Yuhui Kang, Zhiqiang Wang |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
|
| Series: | IEEE Open Journal of Power Electronics |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11091420/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Temperature Characteristics and Junction Temperature Estimation Methods for SiC MOSFET and Si IGBT
by: NING Puqi, et al.
Published: (2016-01-01) -
Numerical Simulation and Optimization Design of Auxiliary Power Inverter Heatsink
by: ZHANG Xiao, et al.
Published: (2015-01-01) -
Thermal Management Technology of New-generation High-voltage SiC Devices Applied in Rail Transit Traction System
by: Kai HE, et al.
Published: (2020-09-01) -
Development of High Performance SiC Hybird Power Module
by: SHAO Yun, et al.
Published: (2013-01-01) -
Characteristics of SiC Device and its Application in Railway Traction
by: LIU kean, et al.
Published: (2016-01-01)