Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate
Interfacial reactions and microstructure evolution of Al/Sn-3.5mass%Ag (SA)/Al, Al/Sn-3.0mass%Ag-0.5mass%Cu (SAC305)/Al, and Cu/SA/Al joints were investigated in this study. The microstructure of the intermetallic compound (IMC) was studied at soldering temperature of 250 °C and a thermal aging temp...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542501717X |
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