Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers
The hybrid integration of electronics in flexible substrates using fanned-out, wafer-level packaging (FOWLP) has recently gained significant attention, with numerous applications in wearable electronics, foldable displays, robotics, medical implants, and healthcare monitoring. In this study, a fully...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-04-01
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| Series: | Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-3900/97/1/153 |
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