Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates
The flow behavior of TC4 was studied through thermal compression experiments conducted at deformation temperatures of 910, 930, 950, and 970 °C, and strain rates of 0.01, 0.1, 1, and 10 s−1. After hot deformation, the dynamic recrystallization mechanisms were characterized by electron backscattered...
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Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424023160 |
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| author | Duqiang Ren Chuanyong Chen Haijun Xuan Huimin Zhou Guo Li |
| author_facet | Duqiang Ren Chuanyong Chen Haijun Xuan Huimin Zhou Guo Li |
| author_sort | Duqiang Ren |
| collection | DOAJ |
| description | The flow behavior of TC4 was studied through thermal compression experiments conducted at deformation temperatures of 910, 930, 950, and 970 °C, and strain rates of 0.01, 0.1, 1, and 10 s−1. After hot deformation, the dynamic recrystallization mechanisms were characterized by electron backscattered diffraction (EBSD) technology. The results showed that the flow stress increased with rising strain rate and decreased with increasing temperature. A constitutive equation, based on the Zener-Holloman parameter, was constructed to predict the flow stress. The resulting model accurately predicted the flow stresses of TC4, with a relative mean prediction error of 7.9%. Analysis of EBSD results revealed that three recrystallization mechanisms coexisted in the current experimental study. Discontinuous dynamic recrystallization was identified as the dominant mechanism, complemented by geometric dynamic recrystallization, and followed by continuous dynamic recrystallization. A relatively small grain size, averaging 4.08 μm, can be obtained at a deformation temperature of 930 °C. Additionally, the trend in grain size variation was comparatively stable at a strain rate of 0.1 s⁻1, with an average grain size of 4.21 μm. |
| format | Article |
| id | doaj-art-2f33aca5f9174a8396d2f62d28e51361 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-2f33aca5f9174a8396d2f62d28e513612024-12-26T08:54:26ZengElsevierJournal of Materials Research and Technology2238-78542024-11-013359625975Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain ratesDuqiang Ren0Chuanyong Chen1Haijun Xuan2Huimin Zhou3Guo Li4College of Energy Engineering, Zhejiang University, Hangzhou, 310027, ChinaCollege of Energy Engineering, Zhejiang University, Hangzhou, 310027, China; Corresponding author.College of Energy Engineering, Zhejiang University, Hangzhou, 310027, ChinaSchool of Energy and Power Engineering, Beihang University, 100191, Beijing, ChinaSchool of Energy and Power Engineering, Beihang University, 100191, Beijing, China; Tianmushan Laboratory, 311100, Zhejiang, ChinaThe flow behavior of TC4 was studied through thermal compression experiments conducted at deformation temperatures of 910, 930, 950, and 970 °C, and strain rates of 0.01, 0.1, 1, and 10 s−1. After hot deformation, the dynamic recrystallization mechanisms were characterized by electron backscattered diffraction (EBSD) technology. The results showed that the flow stress increased with rising strain rate and decreased with increasing temperature. A constitutive equation, based on the Zener-Holloman parameter, was constructed to predict the flow stress. The resulting model accurately predicted the flow stresses of TC4, with a relative mean prediction error of 7.9%. Analysis of EBSD results revealed that three recrystallization mechanisms coexisted in the current experimental study. Discontinuous dynamic recrystallization was identified as the dominant mechanism, complemented by geometric dynamic recrystallization, and followed by continuous dynamic recrystallization. A relatively small grain size, averaging 4.08 μm, can be obtained at a deformation temperature of 930 °C. Additionally, the trend in grain size variation was comparatively stable at a strain rate of 0.1 s⁻1, with an average grain size of 4.21 μm.http://www.sciencedirect.com/science/article/pii/S2238785424023160TC4Thermal deformationFlow behaviorFlow stressDynamic recrystallization |
| spellingShingle | Duqiang Ren Chuanyong Chen Haijun Xuan Huimin Zhou Guo Li Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates Journal of Materials Research and Technology TC4 Thermal deformation Flow behavior Flow stress Dynamic recrystallization |
| title | Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates |
| title_full | Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates |
| title_fullStr | Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates |
| title_full_unstemmed | Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates |
| title_short | Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates |
| title_sort | flow behaviors and dynamic recrystallization mechanisms study of tc4 under different temperatures and strain rates |
| topic | TC4 Thermal deformation Flow behavior Flow stress Dynamic recrystallization |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424023160 |
| work_keys_str_mv | AT duqiangren flowbehaviorsanddynamicrecrystallizationmechanismsstudyoftc4underdifferenttemperaturesandstrainrates AT chuanyongchen flowbehaviorsanddynamicrecrystallizationmechanismsstudyoftc4underdifferenttemperaturesandstrainrates AT haijunxuan flowbehaviorsanddynamicrecrystallizationmechanismsstudyoftc4underdifferenttemperaturesandstrainrates AT huiminzhou flowbehaviorsanddynamicrecrystallizationmechanismsstudyoftc4underdifferenttemperaturesandstrainrates AT guoli flowbehaviorsanddynamicrecrystallizationmechanismsstudyoftc4underdifferenttemperaturesandstrainrates |