Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates
The flow behavior of TC4 was studied through thermal compression experiments conducted at deformation temperatures of 910, 930, 950, and 970 °C, and strain rates of 0.01, 0.1, 1, and 10 s−1. After hot deformation, the dynamic recrystallization mechanisms were characterized by electron backscattered...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424023160 |
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