Flow behaviors and dynamic recrystallization mechanisms study of TC4 under different temperatures and strain rates

The flow behavior of TC4 was studied through thermal compression experiments conducted at deformation temperatures of 910, 930, 950, and 970 °C, and strain rates of 0.01, 0.1, 1, and 10 s−1. After hot deformation, the dynamic recrystallization mechanisms were characterized by electron backscattered...

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Bibliographic Details
Main Authors: Duqiang Ren, Chuanyong Chen, Haijun Xuan, Huimin Zhou, Guo Li
Format: Article
Language:English
Published: Elsevier 2024-11-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424023160
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