STUDY ON REMOVAL MECHANISM OF SINGLE-CRYSTAL SILICON BY PLASMA DISCHARGE (MT)
Aiming at the problems of easy introduction of chemical element residues, micro scratches and low material removal rate in contact chemical mechanical polishing and non-contact plasma polishing processes of single-crystal silicon, a non-contact green polishing method of plasma cavitation stripping f...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Journal of Mechanical Strength
2023-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2023.05.011 |
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