Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor
To enhance semiconductor efficiency, it is imperative to develop a die-bonding material possessing exceptional thermal conductivity and stress-shielding capabilities to safeguard semiconductor components from detrimental heat and destructive stress. In this study, we employed a multi-objective topol...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2024-12-01
|
| Series: | Science and Technology of Advanced Materials: Methods |
| Subjects: | |
| Online Access: | https://www.tandfonline.com/doi/10.1080/27660400.2024.2320691 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|